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SMT connector

SMT Connectors: High-Density Solutions for Modern Electronics

In today's rapidly evolving electronics landscape, achieving reliable and compact interconnections is paramount. SMT (Surface Mount Technology) connectors are engineered to meet this exact demand, offering superior performance for high-density PCB applications. Their design facilitates automated assembly, significantly reducing production time and costs while enhancing overall manufacturing precision. For applications requiring specific configurations, complementary components such as the 2.54 pitch header are often used in conjunction to create a complete interconnect system. Furthermore, when board space is constrained or unique form factors are needed, the right angle version of these connectors provides an ideal routing solution, allowing for perpendicular connections that optimize the use of available space. This makes them indispensable in consumer electronics, telecommunications, and industrial control systems where reliability and space savings are critical.


The SMT Connector stands out due to its robust construction and meticulous design parameters. It is built to withstand the rigors of reflow soldering processes, ensuring a secure and durable bond to the printed circuit board. The housing is typically manufactured from high-temperature resistant plastics, such as LCP or PBT, which provide excellent stability and insulation. The contacts are precision-stamped and formed from phosphor bronze or brass, often with a selective gold plating over a nickel barrier to ensure low contact resistance, superior corrosion resistance, and long-term reliability. The compact footprint of the SMT Connector makes it a perfect choice for miniaturized devices without compromising on electrical performance or mechanical strength.

Key Technical Specifications

  • Pitch: Available in various pitches including 1.27mm, 2.00mm, and 2.54mm.
  • Current Rating: Typically 1.0A to 3.0A per contact.
  • Voltage Rating: Ranges from 50V AC/DC to 250V AC/DC.
  • Contact Resistance: Less than 20mΩ initially.
  • Insulation Resistance: 1000MΩ min. at 500V DC.
  • Withstanding Voltage: 500V AC for one minute.
  • Operating Temperature: -40°C to +105°C.
  • Contact Material: Phosphor Bronze or Brass.
  • Plating: Gold flash over Nickel (Optional: Full Gold).
  • Housing Material: LCP (Liquid Crystal Polymer) or PBT (Polybutylene Terephthalate), UL94V-0 rated.

Detailed Product Parameters

Model Series Pitch (mm) Number of Positions Mating Cycle (Min) IP Rating
SMT-CON-127 1.27 2-40 50 N/A
SMT-CON-200 2.00 2-30 100 N/A
SMT-CON-254 2.54 2-20 100 N/A
SMT-CON-254-RA 2.54 2-20 50 N/A

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